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Wafer Cassette Measurement System

Non-contact measuring system for CD of wafer carrier used in semiconductor process

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Feature
  • Process Performance

    · Machine Dimension: 1330mm X 1230mm X 1700mm

    · Machine Weight: Approx. 1000kg

    · Electric Power: 3Ф 220V 60Hz 10kVA

    · Clean Air: Over 6kg

  • Productivity / Hardware

    · Design of measuring head composed of laser distance sensor, CCD camera and LED ring light

    · Minimize tact time by application of a telecentric lens that provides a wide focal length

    · Automatic door open/close system for the wafer carrier

    · Application of continuous rotary table to measure in various directions

    · Provide jigs for equipment inspection to check machine errors

    · Customize Hardware / UI Software

Specifications


Parameter
Categorization
Specification
Carries Size
300mm wafer carrier
Travel Length
Head
450mm X 100mm X 400mm
Carrier
360° continuous
Movement Resolution
0.1um
Max Velocity
Head
250mm/s
Carrier
90°/2s
Machine Accuracy
Head
3±L/300 (um, L:mm)
Carrier
15arc.sec
Measuring Repeatability
50um

■ Customizable Hardware/Software UI